Qualcomm · Multiple Chipsets
CVE-2022-22071
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
What it is
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
CISA: Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
What to do
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Deadline for US federal agencies: December 26, 2023
More exploited flaws from Qualcomm
| Added | Vulnerability | Product | Severity | Attack chance |
|---|---|---|---|---|
| Mar 3, 2026 | Memory Corruption | Multiple Chipsets | High 7.8 | 1.3% |
| Jun 3, 2025 | Incorrect Authorization | Multiple Chipsets | High 8.6 | 0.8% |
| Jun 3, 2025 | Incorrect Authorization | Multiple Chipsets | High 8.6 | 0.5% |
| Jun 3, 2025 | Use-After-Free | Multiple Chipsets | High 7.5 | 1.1% |
| Oct 8, 2024 | Multiple Chipsets Use-After-Free | Multiple Chipsets | High 7.8 | 0.7% |
| Dec 5, 2023 | Use-After-Free | Multiple Chipsets | High 7.8 | 0.7% |
| Dec 5, 2023 | Use of Out-of-Range Pointer Offset | Multiple Chipsets | High 8.4 | 0.8% |
| Dec 5, 2023 | Integer Overflow | Multiple Chipsets | High 8.4 | 0.7% |
Sources: Known Exploited Vulnerabilities (CISA, public domain), CVE records (cve.org) and EPSS (FIRST). The chance of attacks is the EPSS estimate that someone will try to exploit the flaw in the next 30 days.