Qualcomm · Multiple Chipsets
CVE-2024-43047
Use After Free in DSP Service
Exploited in attacks
High 7.8 Attack chance: 0.7%
What it is
Memory corruption while maintaining memory maps of HLOS memory.
CISA: Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
What to do
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Deadline for US federal agencies: October 29, 2024
More exploited flaws from Qualcomm
| Added | Vulnerability | Product | Severity | Attack chance |
|---|---|---|---|---|
| Mar 3, 2026 | Memory Corruption | Multiple Chipsets | High 7.8 | 1.3% |
| Jun 3, 2025 | Incorrect Authorization | Multiple Chipsets | High 8.6 | 0.8% |
| Jun 3, 2025 | Incorrect Authorization | Multiple Chipsets | High 8.6 | 0.5% |
| Jun 3, 2025 | Use-After-Free | Multiple Chipsets | High 7.5 | 1.1% |
| Dec 5, 2023 | Use-After-Free | Multiple Chipsets | High 8.4 | 0.4% |
| Dec 5, 2023 | Use-After-Free | Multiple Chipsets | High 7.8 | 0.7% |
| Dec 5, 2023 | Use of Out-of-Range Pointer Offset | Multiple Chipsets | High 8.4 | 0.8% |
| Dec 5, 2023 | Integer Overflow | Multiple Chipsets | High 8.4 | 0.7% |
Sources: Known Exploited Vulnerabilities (CISA, public domain), CVE records (cve.org) and EPSS (FIRST). The chance of attacks is the EPSS estimate that someone will try to exploit the flaw in the next 30 days.