BLACKOUT MAP

Qualcomm · Multiple Chipsets

CVE-2026-21385

Integer Overflow or Wraparound in Graphics

Exploited in attacks High 7.8 Attack chance: 1.3%
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What it is

Memory corruption while using alignments for memory allocation.

CISA: Multiple Qualcomm chipsets contain a memory corruption vulnerability while using alignments for memory allocation.

What to do

Apply mitigations per vendor instructions, follow applicable BOD 22-01 guidance for cloud services, or discontinue use of the product if mitigations are unavailable.

Deadline for US federal agencies: March 24, 2026

Added to the CISA list
March 3, 2026
Published
March 2, 2026
Severity
High 7.8 CVSS 3.1
Chance of attacks in the next 30 days (EPSS)
1.3% in the top 29.9% of all known vulnerabilities
Weakness
CWE-190
More details
NVD · CVE.org · CISA
All references (1)

More exploited flaws from Qualcomm

AddedVulnerabilityProductSeverityAttack chance
Jun 3, 2025Incorrect AuthorizationCVE-2025-21479Multiple ChipsetsHigh 8.60.8%
Jun 3, 2025Incorrect AuthorizationCVE-2025-21480Multiple ChipsetsHigh 8.60.5%
Jun 3, 2025Use-After-FreeCVE-2025-27038Multiple ChipsetsHigh 7.51.1%
Oct 8, 2024Multiple Chipsets Use-After-FreeCVE-2024-43047Multiple Chipsets High 7.80.7%
Dec 5, 2023Use-After-FreeCVE-2022-22071Multiple ChipsetsHigh 8.40.4%
Dec 5, 2023Use-After-FreeCVE-2023-33063Multiple ChipsetsHigh 7.80.7%
Dec 5, 2023Use of Out-of-Range Pointer OffsetCVE-2023-33106Multiple ChipsetsHigh 8.40.8%
Dec 5, 2023Integer OverflowCVE-2023-33107Multiple ChipsetsHigh 8.40.7%

All of them →

Sources: Known Exploited Vulnerabilities (CISA, public domain), CVE records (cve.org) and EPSS (FIRST). The chance of attacks is the EPSS estimate that someone will try to exploit the flaw in the next 30 days.