Qualcomm · Multiple Chipsets
CVE-2021-1905
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
What it is
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CISA: Multiple Qualcomm Chipsets contain a use after free vulnerability due to improper handling of memory mapping of multiple processes simultaneously.
What to do
Apply updates per vendor instructions.
Deadline for US federal agencies: May 3, 2022
More exploited flaws from Qualcomm
| Added | Vulnerability | Product | Severity | Attack chance |
|---|---|---|---|---|
| Mar 3, 2026 | Memory Corruption | Multiple Chipsets | High 7.8 | 1.3% |
| Jun 3, 2025 | Incorrect Authorization | Multiple Chipsets | High 8.6 | 0.8% |
| Jun 3, 2025 | Incorrect Authorization | Multiple Chipsets | High 8.6 | 0.5% |
| Jun 3, 2025 | Use-After-Free | Multiple Chipsets | High 7.5 | 1.1% |
| Oct 8, 2024 | Multiple Chipsets Use-After-Free | Multiple Chipsets | High 7.8 | 0.7% |
| Dec 5, 2023 | Use-After-Free | Multiple Chipsets | High 8.4 | 0.4% |
| Dec 5, 2023 | Use-After-Free | Multiple Chipsets | High 7.8 | 0.7% |
| Dec 5, 2023 | Use of Out-of-Range Pointer Offset | Multiple Chipsets | High 8.4 | 0.8% |
Sources: Known Exploited Vulnerabilities (CISA, public domain), CVE records (cve.org) and EPSS (FIRST). The chance of attacks is the EPSS estimate that someone will try to exploit the flaw in the next 30 days.