Qualcomm · Multiple Chipsets
CVE-2021-1906
Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
ما هي
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
CISA: Multiple Qualcomm chipsets contain a detection of error condition without action vulnerability when improper handling of address deregistration on failure can lead to new GPU address allocation failure.
ما العمل
Apply updates per vendor instructions.
الموعد النهائي للوكالات الفدرالية الأمريكية: 17 نوفمبر 2021
ثغرات مُستغلّة أخرى من Qualcomm
| أُضيفت | الثغرة | المنتج | الخطورة | احتمال الهجوم |
|---|---|---|---|---|
| 03/03/2026 | Memory Corruption | Multiple Chipsets | مرتفع 7.8 | 1.3% |
| 03/06/2025 | Incorrect Authorization | Multiple Chipsets | مرتفع 8.6 | 0.8% |
| 03/06/2025 | Incorrect Authorization | Multiple Chipsets | مرتفع 8.6 | 0.5% |
| 03/06/2025 | Use-After-Free | Multiple Chipsets | مرتفع 7.5 | 1.1% |
| 08/10/2024 | Multiple Chipsets Use-After-Free | Multiple Chipsets | مرتفع 7.8 | 0.7% |
| 05/12/2023 | Use-After-Free | Multiple Chipsets | مرتفع 8.4 | 0.4% |
| 05/12/2023 | Use-After-Free | Multiple Chipsets | مرتفع 7.8 | 0.7% |
| 05/12/2023 | Use of Out-of-Range Pointer Offset | Multiple Chipsets | مرتفع 8.4 | 0.8% |
المصادر: Known Exploited Vulnerabilities (CISA، ملكية عامة)، وCVE records (cve.org)، وEPSS (FIRST). احتمال الهجوم هو تقدير EPSS لاحتمال أن يحاول أحد استغلال الثغرة خلال الأيام الـ30 القادمة.